The new European "Fifth Framework Programme"is a program to develop wafer-to-wafer bonding techniques for long-term vacuum encapsulation, creating MEMS vacuum cavities.
The vacuum wafer bonding will be optimized using eutectic bonding along with Getter materials in the cavity,and a hermetic feed-through will also be developed for vertical vias through the cap wafer.
Different applications possible are RF switch and high-frequency resonators for telecom and consumer use. A pressure sensor for high-reliability avionics and industrial applications will also be manufactured.

Contributors to this program are STMicroelectronics'MEMS development as the leader of the project, Saes Getters, Thales Avionics, EV Group, E Thallner, Pavia University and Fraunhofer Institute for Silicon Technology (ISIT).