ICICDT 2008
 
 
Program Highlights
 

International Conference
on IC Design & Technology
Minatec Grenoble, France;
June 2nd – June 4 th, 2008




As IC design & process technology continue to advance for increased performance, lower power, and accelerated time-to-market, the engineering activities, traditionally separated along the boundary of design and process technology, will have difficulties in meeting the shrinking window of product optimization tasks.
The International Conference on IC Design & Technology provides a forum for engineers, researchers, scientists, professors and students to cross this boundary through interactions of design and process technology on product development & manufacturing. The unique workshop style of the conference provides an opportunity to technologists and product designers to e xchange breakthrough ideas and collaborate effectively.
Two days of technical presentations and workshops will be preceded by a one-day tutorial program of value to both the expert and the beginner.
 
Tutorials (June 2nd):
  • Prof. Kuroda - Kieo University - JapanTahir Ghani - Intel Fellow - USADr. Itoh – Hitachi Fellow - JapanPhilip Christie - Senior Principal Scientist NXP - EuropeProf. Wolf - Spintronics - Virginia University - USAAli Keshavarzi - Senior Staff Research Scientist Intel - USA
  • Dr. Bourgoin JP. – Director of Nanoscience program CEA - Europe
Conference (June 3rd, 4th):


•  Download Advanced Program

•  Keynotes:

  • SOC in the post 45nm era, Dr Uming Ko, TI Senior Fellow
  • Synergy between design and process: a key differentiator in the evolving microelectronic landscape, Michel Brillouët, CEA-LETI Deputy Manager

 •  Invited Papers:

30 Contributions solicited by the ICICDT committee members from:

  • INTEL, ST Microelectronics, IMEC on Advanced Transistor Structure, Architecture and Process
  • INTEL, CEA-LETI, AMO GmbH on Emerging Technologies
  • NXP, IBM, ST, MIRAI on Reliability
  • HITACHI, NXP, INTEL, IMEC on Advanced Memory Devices
  • CISCO Systems, SUN on Soft Error Rate
  • SUN, INTEL, QUALCOM on DFM/DFT/DFY/DFR
  • Tokyo University, CEA-LETI on Low Power
  • QUALCOM, NXP on System Level technology  Assessment
  • ST Microelectronics, Bologna University, IBM, FREESCALE on SoC/MPSoC/SIP, IC & Platform Design & Process
  • Pavia University, IMS, IEMN, CEA-LETI ANSOFT on RF & AMS

 
•  60 Regular Papers

 
Registration at www.icicdt.org (early date April 30th)
 

The venue of 2008 ICICDT will be Minatec® – Grenoble, France

 

ICICDT features a popular and unique format structured to maximize face-to-face interaction. An abbreviated synopsis of each paper is presented in a plenary session, following which a workshop-style forum allows for deeper give-and-take communication on an individual basis.

 
 
   


 
 

[Actualité Minatec] [Revue de presse Minatec] [La lettre Minatec] [Agenda local] [Agenda International]