MINATEC

Direct bonding is a physical phenomenon that allows two surfaces to adhere spontaneously without added material. This phenomenon has been studied extensively in research and companies such as SOITEC TRACIT or commercialize products based on this technology. Research still active have to implement physical and chemical models for better understanding of this phenomenon of adhesion.

Direct bonding is a physical phenomenon that allows two surfaces to adhere spontaneously without added material. This phenomenon has been studied extensively in research and companies such as SOITEC TRACIT or commercialize products based on this technology. Research still active have to implement physical and chemical models for better understanding of this phenomenon of adhesion. However, these models do not currently process that surfaces where silicon oxide and silicon can take into account that the chemistry of surfaces.

Currently, for innovative applications of photovoltaic, or three-dimensional integration of power electronics, it is imperative to have a technical report or film circuit using a direct bonding electrically conductive ( connections with local or not) and heat dissipation. The bonding metal layer is then an excellent candidate.

We hope in the thesis proposed, leading to a physicochemical model of such direct bonding using new layers of metal bonding and metal oxide.