Thesis, internship, and post-doc opportunities
[Thèse]
Introduction of innovative materials for direct multiple beams lithography to assess advanced integrated processes addressing 15nm technology node
Offer N°: 2587
The electron beam lithography is now a technological solution recognized, mature and widely used in laboratories and universities, to produce very advanced structures with great flexibility. Until now, the scope of direct writing has always been considered as marginal because of its low throughput.
The electron beam lithography is now a technological solution recognized, mature and widely used in laboratories and universities, to produce very advanced structures with great flexibility. Until now, the scope of direct writing has always been considered as marginal because of its low throughput. With the willingness of the industry's semi-conductor to minimize manufacturing costs, lithography called "Maskless" (without mask) is becoming a competitor to the optical lithography to address the technology nodes 15nm and below. But it is mandatory to demonstrate its capability to write speed equivalent to 10 wafers per hour with a maximum total footprint of 1m ² for 2013. To improve this, the solution is to write the circuit simultaneously through multiple electron beams individually controlled in parallel, hence the emergence of multi-beam electron beam lithography, also called Multibeam platform (ML2). The European project "MAGIC", started in 2008 and led by CEA-LETI, has generated significant momentum in this direction, around two European equipments; MAPPER (Holland) and IMS-Nano Manufacturing (Austria). The aim of the thesis is to assess this alternative direct lithography solution in order to accelerate its development into industrial like environment for advanced 15nm technology nodes.