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[Thèse]

In line characterization and study of spatial deformity generated by stress during MEMS fabrication yielding to their damage

Offer N°: 2301

Start date: 1 Dec 2010

Performances and fabrication improvements of MEMS yield to an increase of their miniaturization. While their dimension shrink the stress and deformation to which they are submitted become more and more important. So there is a real need to characterize and monitor Microsystems deformations and link them to their performances and integrity at fabrication time.



[Thèse]

Carrier transport in Si nanowire MOSFETs

Offer N°: 2307

Start date: 1 Oct 2010

Context of the work :



[Thèse]

Development of insulating layers for the gate stack and the passivation of MIS-HFETs transistors on GaN compound

Offer N°: 2291

Start date: 1 Sep 2010

III-V compounds gallium nitride GaN has physical characteristics superior to that of Si or GaAs for the development of LED, microwave components for power or power electronics.

For power applications, the MIS-HFETs transistor (Metal Insulator Semiconductor - Heterostructure Field Effect Transistor) has the best performance but it requires the development of a dielectric layer for gate structure and for interface passivation.



[Thèse]

Pitch division techniques to pattern logic IC

Offer N°: 2282

Start date: 1 Oct 2010

Unfortunately conventional optical photolithography is running out of steam for the 22 nm node as no shorter wavelength/larger numerical aperture is expected to be ready on time. This implies that most critical layers will be printed using double patterning techniques. Among them, sidewall image transfer processes demonstrate high potential performances down to the 16 nm node and even beyond depending on next generation lithography tools availability.



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